Mold compounds can be used to encapsulate a range of electronic packages, including capacitors, transistors, central processing units, and memory devices. In basic terms, the process can be considered in two stages. First, the components to be encapsulated are transferred into mold cavities.
In basic terms, the process can be considered in two stages. First, the components to be encapsulated are transferred into mold cavities. Following this stage, a mold compound, having been liquefied by either heat or pressure, is forced into the cavity where it solidifies into a plastic encapsulated device (Figure 1). Figure 1.
In mold resin sealing, the reliability of the power module is high thanks to sealing by transfer molding. However, an expensive mold is required, making it difficult to change the module structure. In addition, the productivity of sealing large modules deteriorates since there is a limit to the size of molds.
DP resin sealing does not require molds and its resistance to moisture permeability is high compared to silicone gel. It is considered that DP resin sealing could reduce the deterioration of solder materials at the bottom of semiconductor devices as a result of thermal cycles. These factors suggest that DP resin sealing can achieve
This is especially the case for components used in surface mount technology, where cost and volume are important factors. In compression moulding, a thermoplastic or thermosetting resin is placed in a heated mould which is then closed, and heat and pressure are applied, causing the material to flow and fill the mould.
Also, molded substrate can be done at a large panel, which greatly improve the production efficiency. In addition, multilayer molded substrates can be fabricated using multi-layer molding. It is believed that molded substrates might be used in FCCSP with multi-layer substrate (Fig. 9.36).