100nF/mm2 (PICS3HV). 2. Stability over a large temperature range Most of the capacitors commercially available for use at 220°C show a significant change in capacitance above 150°C. In comparison, the PICS capacitor is extremely stable with a temperature coefficient of capacitance (TCC) below 80ppm from room temperature to 300°C (Fig.4).
The defined dimensions of the integrated components are 400mm in depth and 600mm in cabinet width. The benchmark for the calculation of necessary cabinet depths is the ∆T between the inside of the cabinet and the ambient temperature in Kelvin as well as the expected cooling capacity, Q, in kW.
The high density Silicon capacitors with multiple metal-insulator-metal (MIM) layer stacks in 3D structures are reaching today 250nF/mm2 in mass production and have been demonstrating densities of up to 1μF/mm2, confirming the target of more than 4μF/mm2 in the coming years.
IPDiA is addressing under-the-hood electronics and automotive sensors with its 3D Silicon Capacitor technology called PICS3HV offering miniaturized capacitors that withstand 200°C working at 16V.
IPDiA Capacitors are used for their outstanding performances at temperatures up to 250°C .In this paper some results (lifetime, stability, leakage, thermo mechanical), were depicted in order to prove that they are reliable for long term service.
Most of the capacitors are limited to a maximum of 150°C whereas electronic devices require solutions operating at 175°C, with a trend to push the temperature envelope to 200°C, at high voltage and high current. Required features are very high reliability, low leakage current, good stability with voltage, time and humidity.