At this point, the polymer absorbed oxygen and generated insulating materials, which isolated the defective portion from the remainder of the capacitor. Despite the loss of some effective capacitance, the self-healing process had a negligible impact on the overall performance, while substantially reducing the LC [40, 41].
The effect of electroplating conditions on the electrical properties of the tantalum electrolytic capacitors (TECs) was comprehensively studied. The results demonstrated that incorporating a copper metal layer into the structure of the capacitors significantly reduced the ESR of TECs.
This kind of capacitor had a high capacitance density, good low-temperature performance, and long service life, and was widely used in various electronic devices. However, solid tantalum electrolytic capacitors with MnO 2 still have several drawbacks. Firstly, the use of MnO 2 with high resistance makes it have a high ESR.
Tantalum electrolytic capacitors (TECs) have gained popularity due to their exceptional electrical performance, reliability, and high capacitance density . However, traditional TECs had limitations, particularly in high-frequency circuits, power supplies, and digital circuits.
In 1956, H.E. Haring and R.L. Taylor from Bell Labs designed the first generation of solid tantalum electrolytic capacitors, which utilized tantalum pentoxide (Ta 2 O 5) as the dielectric layer, manganese dioxide (MnO 2) as the cathode material, and graphite silver paste as the auxiliary cathode layer .
The capacitor was designed based on a Metal/Insulator/Conductive Polymer/Metal structure, where a copper layer was electroplated onto the surface of PEDOT polymer tantalum electrolytic capacitors (P-PTECs).