What are the capacitor potting materials

What is potting in electronics?

In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound. This is done to exclude water, moisture, or corrosive agents, to increase resistance to shocks and vibrations, or to prevent gaseous phenomena such as corona discharge in high-voltage assemblies.

Why do electronic components need potting?

Potting also provides heat dissipation, flame retardance, and cushioning from shock. If potting does not exist, the electronic components may fail due to vibration, electrical faults, heat, or other environmental conditions, that exist in electronic applications.

What type of potting compound can be used on a circuit board?

Conformal coatings can be applied as liquid or condensed from a vapor phase. When potting a circuit board that uses surface-mount technology, low glass transition temperature (T g) potting compounds such as polyurethane or silicone may be used.

What are potting materials?

The examined potting materials were the Emerson and Cuming Stycast 2651-40 FR, Insulcast 3258LIP, and Cytec Conapoxy FR 1403. A potting material is a multicomponent mixture of an encapsulating resin with various types of additives. Polymeric resins (such as epoxies, silicones, polyurethanes, etc.) are usually used as potting materials.

How does potting work?

Potting involves inserting the electronic component or assembly within a container, filling the container with a liquid resin, and then curing the material as an integral part of the component. Potting compounds can either be mixed and dispensed for encapsulation at the point of use or acquired as a premixed, frozen formulation.

Why is potting used in encapsulation?

Potting has also been used to protect against reverse engineering or to protect parts of cryptography processing cards. When such materials are used only on single components instead of entire assemblies, the process is referred to as encapsulation.