Abstract: This paper seeks to explore the channel performance and advantages of a new placement strategy for DC-Block capacitors that significantly reduces the board space required.
Embedding capacitors and resistors into printed circuit boards (PCBs) offers many benefits over surface mount technology (SMT) and through-hole packaging (PTH). These benefits include improvements in electrical performance and reliability, and potential cost reduction. Embedded devices also enable signal integrity at speeds over 1 GHz.
In traditional capacitor placement there is no coupling between differential pairs, but there is a space requirement of approximately 1500mils x 800mils for implementation. A more compact cross-pattern design was developed which requires only 900mils x 100mils. This cross-pattern technique reduces the required board space by approximately 61%.
Electrical Properties of Typical Buried Capacitor Materials There are potentially two major incentives for using a buried capacitance PCB design. The first is a reduction in EMI radiation. Buried capacitor innerlayers will reduce EMI radiation and often offer a simple solution to what can be a difficult and time consuming issue.
This paper presents a manufacturing technique, which is suitable for the fabrication of embedded capacitors and resistors in PCBs on a large scale.
Also, the mean time between failure (MTBF) of a product will be better if decoupling capacitors are replaced by embedded capacitors; the MTBF values can be calculated with reference to the DoD MIL-HDBK-217 or the Bellcore FR-NWT-000978.