Film dielectrics possess larger breakdown strength and higher energy density than their bulk counterparts, holding great promise for compact and efficient power systems. In this article, we review the very recent advances in dielectric films, in the framework of engineering at multiple scales to improve energy storage performance.
Summary of high-temperature dielectric films recently developed for energy storage. Crosslinking is a good strategy to limit the molecular chain motion and is studied in several published works, demonstrating the reduced dielectric relaxation, improved breakdown strength, and efficiency of the film capacitors.
These results indicate that the preparation of high quality epitaxial ferroelectric film on silicon substrate and the introduction of a heat conduction layer are effective strategies to improve the energy storage performance with high thermal stability of silicon integrated film capacitors.
Exploring low content of nano-sized fillers to enhance dielectric energy storage can minimize the process difficulty in dielectric film manufacturing. This review emphasizes the significant advantages of low filler content in a polymer nanocomposite.
Prof. Li from Tsinghua University has proposed the use of all-organic fillers/polymer dielectric films for high-temperature applications. Three commercial molecular semiconductors, including ITIC, PCBM, and DPDI with different electron affinities, were selected as fillers to improve the high-temperature energy storage of PEI films.
Due to the vast demand, the development of advanced dielectrics with high energy storage capability has received extensive attention , , , . Tantalum and aluminum-based electrolytic capacitors, ceramic capacitors, and film capacitors have a significant market share.